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We are a leading Chinese manufacturer of abrasives.
Remember us
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privacy policy
Silicon carbide grinding disc
Structure and manufacturing
Structural composition: usually consists of a working layer, substrate, and other parts. The working layer is the part containing silicon carbide abrasive, which directly contacts the material being processed and determines the grinding performance of the grinding disc; the substrate supports the working layer. Common substrate materials include metal, resin, and ceramics. Different substrate materials give the grinding disc different physical and chemical properties.
Manufacturing Process
Coating Method: Silicon carbide micropowder is uniformly mixed with a high-performance adhesive, then applied to the surface of high-strength polyester film or other substrate materials using ultra-precision coating technology. The material is then dried and cured to form the grinding disc. This method allows precise control over the thickness of the grinding layer and the distribution of abrasive particles, making it suitable for producing high-precision grinding discs.
Sintering Method: Silicon carbide powder is mixed with an appropriate amount of binder, molded into shape, and then sintered at high temperatures to form a strong bond between silicon carbide particles and between particles and the binder, resulting in grinding discs with specific shapes and strength. Grinding discs produced by the sintering method have high hardness and wear resistance but involve a relatively complex process and higher costs.
Application
Semiconductor Industry: Used for grinding and polishing semiconductor wafers such as silicon carbide and silicon, including removing surface damage layers after cutting, improving wafer flatness and thickness uniformity, and providing high-quality wafer surfaces for subsequent lithography, etching, and other processes.
Optical Industry: Used for grinding and polishing optical glass, crystals, and other materials to manufacture various optical components such as lenses, prisms, and mirrors, meeting the requirements for surface precision and surface finish of optical system components.
Machine Tool Industry: Used for grinding and polishing metal parts, molds, etc., to remove defects such as burrs, flash, and scratches from the surface of parts, improving dimensional accuracy and surface quality, as well as enhancing wear resistance, corrosion resistance, and fitting accuracy.
Ceramic processing field: Suitable for grinding and polishing ceramic products such as ceramic tools, ceramic bearings, and ceramic substrates, improving the surface finish and dimensional accuracy of ceramic products, and enhancing their performance and service life.
| Grit/μm | 1 | 3 | 9 | 15 | 16 | 30 |
| Mesh | 8000 | 5000 | 3000 | 1200 | 3000 | 600 |
| Abrasive | SiC | SiC | SiC | SiC | SiC | SiC |
| Size | 127/203/380/ Custom | 127/203/380/ Custom | 127/203/30/ Custom | 127/203/380/ Custom | 127/203/380/ Custom | 127/203/380/ Custom |
| Application | Optical communication | Optical communication | Optical communication/3C electronic components | Optical communication/3C electronic components | Optical communication/3C electronic components | Optical communication/3C electronic components |
Working Principle
Cutting Action: Under the action of grinding pressure and grinding motion, the sharp silicon carbide particles on the surface of the silicon carbide grinding disc act like countless tiny knives, cutting the surface of the material being processed and gradually removing the microscopic protrusions on the surface of the material, making the surface of the material flat.
Friction and Polishing Action: As grinding progresses, the friction between the silicon carbide particles and the material surface causes atomic displacement and rearrangement, thereby achieving a polishing effect and improving the surface finish of the material.
Material Properties
High Hardness: Silicon carbide has a Mohs hardness of 9.5 and a microhardness of 2940–3300 kg/mm². with a Knoop hardness of 2670–2815 kg/mm², second only to diamond, cubic boron nitride, and boron carbide. This gives silicon carbide grinding discs exceptional grinding capability, enabling efficient grinding of various hard materials.
Excellent wear resistance: Due to its high hardness and stable chemical properties, silicon carbide grinding discs wear slowly during grinding, have a long service life, maintain stable grinding performance, and reduce the cost and time associated with frequent disc replacements.
Strong chemical stability: It exhibits excellent chemical stability, resisting corrosion from acids, alkalis, and other chemical substances, and maintains consistent performance across diverse working environments, making it suitable for grinding materials with varying chemical properties.
Excellent thermal conductivity: They can quickly dissipate heat generated during grinding, effectively lowering the temperature in the grinding area, preventing workpieces from deforming or burning due to overheating, and improving grinding quality and workpiece yield.
Material Properties
High Hardness: Silicon carbide has a Mohs hardness of 9.5 and a microhardness of 2940–3300 kg/mm². with a Knoop hardness of 2670–2815 kg/mm², second only to diamond, cubic boron nitride, and boron carbide. This gives silicon carbide grinding discs exceptional grinding capability, enabling efficient grinding of various hard materials.
Excellent wear resistance: Due to its high hardness and stable chemical properties, silicon carbide grinding discs wear slowly during grinding, have a long service life, maintain stable grinding performance, and reduce the cost and time associated with frequent disc replacements.
Strong chemical stability: It exhibits excellent chemical stability, resisting corrosion from acids, alkalis, and other chemical substances, and maintains consistent performance across diverse working environments, making it suitable for grinding materials with varying chemical properties.
Good thermal conductivity: They can quickly conduct heat generated during grinding, effectively lowering the temperature in the grinding area, preventing workpieces from deforming or burning due to overheating, and improving grinding quality and workpiece yield.
Proper installation and use of equipment: Install the silicon carbide grinding disc correctly on grinding equipment such as grinders or polishers, and ensure that parameters such as rotational speed, pressure, and feed rate are set in accordance with the disc's usage requirements and processing needs.
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