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Diamond Micro-finishing Film Roll

Micron-graded diamond grains are usually used. These diamond particles have extremely high hardness and sharpness, which are the key factors for achieving microfinishing functions and can effectively cut and grind the surfaces of various materials.

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  • Description
  • Structure and Composition

    • Diamond particles: Micron-graded diamond grains are usually used. These diamond particles have extremely high hardness and sharpness, which are the key factors for achieving microfinishing functions and can effectively cut and grind the surfaces of various materials.

    • Backing material: It is generally a high-strength polyester film, such as 190µm/7.5mil and 125µm/5mil PET films. Polyester film has good flexibility, strength, and chemical corrosion resistance, which can provide stable support for diamond particles and ensure that the film will not easily break or deform during the grinding process.

    • Adhesive: A resin adhesive is used to firmly fix the diamond particles on the polyester film. This adhesive needs to have strong bonding force to prevent the diamond particles from falling off during the grinding process, and at the same time, it should have a certain degree of flexibility to adapt to the pressure and deformation during the grinding process.




    • Machinery processing industry: It is used for grinding and polishing precision parts, such as pistons, cylinder liners of automobile engines, valve cores and valve sleeves of hydraulic components, etc. It can improve the surface finish and dimensional accuracy of parts, enhance the wear resistance and sealing performance of parts, and prolong the service life of parts.

    • Optical field: In the processing of optical lenses, prisms, lenses and other optical components, diamond microfinishing films can be used for high-precision grinding and polishing to obtain optical-grade surface quality, ensuring the light transmittance and imaging quality of optical components.

    • Electronics industry: It can be used for grinding and polishing of semiconductor wafers, as well as surface treatment during the packaging of electronic components. It can improve the flatness and finish of wafers and electronic components, ensuring the performance and reliability of electronic components.

    • Jewelry processing industry: It is used for grinding and polishing jewelry such as diamonds and gemstones, which can make the surface of jewelry show a bright luster and perfect 切面,and improve the quality and value of jewelry.

    • Mold manufacturing industry: The grinding and polishing of mold surfaces can improve the surface quality and demolding performance of molds, thereby ensuring the quality and production efficiency of mold-formed parts.


    Characteristics

    • High-precision grinding: Micron-sized diamond particles can achieve very precise grinding effects, which can reduce the surface roughness of the workpiece to an extremely low level, meeting the requirements of various high-precision processing, such as the processing of aerospace parts and optical components.

    • Efficient cutting: The high hardness and sharpness of diamond make the cutting efficiency in the grinding process very high, which can quickly remove the material on the surface of the workpiece, shorten the processing time, and improve production efficiency.

    • Long service life: Due to the extremely strong wear resistance of diamond and the ability of the resin adhesive to firmly fix the diamond particles, the diamond microfinishing film has a long service life under normal use conditions, reducing the frequency of replacing grinding materials and lowering processing costs.

    • Suitable for both dry and wet use: The polyester film backing has waterproof performance, so that the diamond microfinishing film can be used under dry conditions or with water-based or oil-based lubricants under wet conditions. Wet grinding can effectively reduce the temperature during the grinding process, reduce thermal damage to the workpiece surface, and at the same time take away the debris generated during the grinding process to improve the grinding quality.

    • Strong adaptability: It can be used to process various hard materials, such as cemented carbide, ceramics, gemstones, hardened steel, etc. In addition, according to different processing requirements, diamond particles of different particle sizes and backing materials of different thicknesses can be selected to adapt to different processing technologies and workpiece requirements.