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HOME\Products\Polishing film

Electrostatically Planted Diamond Polishing Film

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  • Description

    • Electrostatically Planted Diamond Polishing Film

    Core Definition and Technical Background

    The electrostatically planted diamond polishing film is a superhard polishing material that vertically implants diamond abrasives into substrates (such as polyester films or non-woven fabrics) using electrostatic field forces. The core technology lies in the ordered arrangement of diamond abrasives via electrostatic sand planting, which improves cutting efficiency by 30%–50% compared to traditional pressing methods. It is particularly suitable for precision polishing of hard materials (e.g., tungsten carbide, ceramics, sapphire).

    Structure and Process Principle

    1. Three-Layer Core Structure

    ComponentMaterial CharacteristicsFunction
    Base LayerPolyester film (PET)/non-woven/metal foilProvides mechanical support, wear resistance, and tear resistance
    Bonding LayerEpoxy resin/polyurethane adhesiveFixes abrasives and ensures bonding strength between abrasives and the base
    Abrasive LayerDiamond micropowder (particle size 1–100μm)Directly participates in polishing, determining cutting efficiency and precision



    Typical Application Cases

    Application FieldMaterial ProcessedPolishing RequirementPolishing Film Selection
    Hard alloy cutting toolsTungsten carbide bladesEdge roughness Ra ≤ 0.2μm, sharpness2000#–5000# fine grinding film
    Semiconductor industrySilicon wafers/sapphire substratesSurface flatness ≤1μm, Ra ≤0.05μm8000# diamond polishing film
    Aerospace componentsTitanium alloy/ceramic partsHigh-temperature wear resistanceElectrostatically planted CBN-diamond composite film

    Technical Trends

    • Nano-abrasive integration: Developing nano-diamond polishing films (particle size <0.1μm) for atomic-level surface finishing in quantum chip substrates.

    • Flexible substrate innovation: Using polyimide (PI) films to enable polishing of curved surfaces (e.g., 3D glass for smartphones).

    • Eco-friendly technology: Replacing solvent-based adhesives with water-based systems to reduce VOC emissions.





    Classification and Application Scenarios

    1. Classification by grit size

    • Coarse grinding type (80#–200#): Removes oxide layers or casting defects from tungsten carbide blanks, used with surface grinders.

    • Fine grinding type (500#–2000#): Refines surface texture for pre-polishing, suitable for pre-processing hard alloy tool edges.

    • Polishing type (above 5000#): Achieves mirror finishes, commonly used in semiconductor silicon wafers, optical lenses, and jewelry processing.



    Principle of Electrostatic Sand Planting

    • Key Steps:

      1. Substrate pretreatment: Clean the substrate and apply a uniform adhesive layer.

      2. Electrostatic field establishment: Generate a strong electric field (50–100kV) via a high-voltage electrostatic generator, charging abrasive particles for adsorption.

      3. Vertical implantation of abrasives: Charged diamond particles "stand" vertically in the adhesive layer under the electric field (as shown in Figure 1), maximizing the exposure of cutting edges.

      4. Curing and shaping: Harden the adhesive via thermal curing (60–120°C) or UV curing to fix abrasive positions.

    • Comparison with compression method:

      Process TypeAbrasive ArrangementCutting EfficiencyPolishing ConsistencyAbrasive Utilization
      Electrostatic plantingVertical and orderedHigh (directional cutting edges)Good (uniform wear)Over 90%
      Compression methodRandom and disorderedLow (abrasives 倒伏)Poor (localized wear)50%–70%



    Performance Advantages and Technical Indicators

    1. Core Advantages

    • Efficiency improvement: Vertical abrasive arrangement concentrates the cutting force of single particles, achieving a material removal rate of 0.1–0.5 mm/h for tungsten carbide polishing (only 0.05 mm/h with traditional sandpaper).

    • Precision control: Enables surface roughness Ra ≤ 0.05 μm (mirror finish), with abrasive layer thickness tolerance ≤ ±5 μm.

    • Extended service life: Uniform abrasive stress makes the polishing film last 3–5 times longer than ordinary sandpaper (e.g., 1000# polishing film can process 500 tungsten carbide blades).

    • Strong adaptability: Suitable for complex shapes (planes, curves, inner holes), even for microhole polishing with diameters ≤1 mm.

    2. Key Technical Indicators

    IndicatorRangeInfluencing Factors
    Grit size80# to 8000# (180μm to 1.5μm)Determines polishing stage (coarse→fine→polish)
    Bond strength≥50N/cm (measured by tension test)Adhesive type and curing process
    Abrasive density40–60 particles/mm²Electric field strength and planting time
    Base thickness50–200μmBalance between flexibility and support


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